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自动化焊锡机的三个专业术语介绍

发布时间:2018-10-29 16:38:37   来源:本文搜集于网络,由自动焊锡机厂家创盈时代整理并发布,欢迎转载    点击:

润湿,润湿过程是指已经熔化了的焊料借助毛细管力沿着母材金属表面细微的凹凸和结晶的间隙向四周漫流,从而在被焊母材表面形成附着层,使焊料与母材金属的原子相互接近,达到原子引力起作用的距离。
Wetting, wetting process refers to the already melted solder with the capillary force along the metal surface of the substrate fine bump and crystallization of the gap to the surrounding overland, thereby forming the adhesion layer on the surface of the welding master material, so that the solder and the parent metal atoms close to each other, to achieve the atomic gravitational effect of the distance.

桌面焊锡机

扩散,伴随着润湿的进行,焊料与母材金属原子间的相互扩散现象开始发生。通常原子在晶格点阵中处于热振动状态,一旦温度升高。原子活动加剧,使熔化的焊料与母材中的原子相互越过接触面进入对方的晶格点阵,原子的移动速度与数量决定于加热的温度与时间。
Diffusion, along with wetting, the interaction between the solder and the metal atoms of the parent metals began to occur. Usually atoms are in a thermal oscillation state in lattice lattices, once the temperature rises. Atomic activity intensifies, so that the molten solder and the atoms in the base metal cross the contact surface into each other's lattice lattice, the speed and quantity of the atom depends on the temperature and time of heating. 

冶金结合,由于焊料与母材相互扩散,在2种金属之间形成了一个中间层---金属化合物,要获得良好的焊点,被焊母材与焊料之间必须形成金属化合物,从而使母材达到牢固的冶金结合状态。
Metallurgical combination, due to the mutual diffusion of solder and masterbatch, between 2 kinds of metals formed an intermediate layer---metal compound, to obtain a good solder joint, the solder between the base material and solder must form a metal compound, so that the parent material to achieve a solid metallurgical bonding state.

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原文地址:http://www.chytime.com/news/hxjs/1770.html

本文关键字:自动焊锡机

本文由www.chytime.com 深圳创盈时代科技有限公司 自动点胶机整理,欢迎转载,转载时请标明出处。

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