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自动焊锡机的焊膏选择应该注意哪些细节

发布时间:2017-10-28 15:25:23   来源:本文转载于网络,由自动焊锡机厂家创盈时代整理,欢迎转载    点击:

自动焊锡机焊接过程中焊膏是必不可少的助焊剂,好的焊膏不但可以增加我们焊锡的效率,还能有效的延长烙铁头的使用寿命。

其实我们选择焊膏主要根据根据产品本身的价值和用途、表面组装板的组装密度、PCB和元器件存放时间和表面氧化程度、生产线工艺条件等实际情况来选择焊膏,不同的产品要选择不同的焊膏。

In the automatic soldering machine welding process, solder paste is essential flux, good solder paste can not only increase the efficiency of our solder, but also effectively prolong the service life of the soldering iron head. In fact, we choose the main solder paste solder paste to choose according to the actual situation according to the value of the product itself and use, surface mount board density assembly, PCB and devices, storage time and surface oxidation degree and production process conditions etc.. Different products should choose different solder paste.

自动焊锡机

焊膏合金粉末的组分、纯度及含氧量、颗粒形状和尺寸、焊剂的成分与性质等是决定焊膏特性以及焊点质量的关键因素

The components, purity and oxygen content, particle shape and size, composition and properties of solder paste are the key factors to determine solder paste characteristics and solder joint quality.

a 根据产品本身的价值和用途,高可靠性的产品需要高质量的焊膏

A according to the value and use of the product itself, high reliability products need high quality solder paste.

b 根据PCB和元器件存放时间和表面氧化程度来决定焊膏的活性

B determines the activity of solder paste according to the storage time and surface oxidation degree of PCB and components.

c 根据产品的组装工艺、印制板、元器件的具体情况选择焊膏合金组分。

C selects solder paste alloy components according to the product assembly process, the printed circuit board and the components.

d 根据产品(表面组装板)对清洁度的要求来选择是否采用免清洗

D according to the product (surface assembly board) requirements for cleanliness to choose whether to use clean.

e BGA和CSP一般都需要采用免清洗焊膏

E BGA and CSP generally need to use clean solder paste

f 焊接热敏元件时,应选用含铋的低熔点焊膏。

Bismuth containing low melting point solder paste should be chosen when welding f thermal sensitive components.

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原文地址:http://www.chytime.com/news/hxjs/1674.html

本文关键字:自动焊锡机焊膏

本文由www.chytime.com 深圳创盈时代科技有限公司 自动点胶机整理,欢迎转载,转载时请标明出处。

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